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Advanced Ceramic Slicing Technology — Crystal Systems ...

A FAST production slicer with diamond-plated blades has been designed and built to slice hard ceramic materials like sapphire at higher cutting rates with higher accuracy and increased wafers per inch. The key to slicing hard materials with diamond on wire is to achieve high force on the diamonds to drive the sharp tips into the workpiece.

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Diamond Wire(Rejin bond,Electroplated) | NORITAKE CO.,LIMITED

The fixed abrasive grain method enables high precision, high eficiency slicing. The stable slicing precision reduces decomposed layers when slicing. Hard materials can be sliced with a high eficiency. Applications: Slicing of silicon, magnetic materials, SiC, GaN, etc. Slicing of silicon, sapphires, magnetic materials, SiC, GaN, etc.

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Slitting Saw: Arbor, Blades, & Speeds and Feeds Calculator ...

Slitting Saw: Arbor, Blades, & Speeds and Feeds Calculator [Easy Guide] CNC Feeds & Speeds Cookbook Introduction to Slitting Saws. Slitting Saws come in a variety of sizes and are typically made of either HSS or Carbide. A Slitting saw is a handy but somewhat delicate tool for certain kinds of cuts.

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Machining Tough Ceramic Materials | 2017-05-01 | Ceramic ...

May 01, 2017 · From next-generation missile domes for defense systems to hip implant components for the medical industry, the mechanical properties of ceramic materials make them ideal for a wide range of applications. Ceramic materials such as aluminum oxide (alumina) and silicon nitride possess many beneficial qualities: extreme toughness, the ability to withstand high temperatures, and resistance to ...

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Wafer Slicing and Wire Saw Manufacturing Technology

wire saws have been known to be used in cutting hard materials like granite slabs and other variety of stones. However, requirements on wire saw cutting in terms of wafer thickness and quality are very different in electronics and photovoltaic applications than the traditional use of the process.

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Grinding wheel - Wikipedia

They are used for grinding extremely hard materials such as carbide cutting tips, gemstones or concrete. The saw pictured to the right is a slitting saw and is designed for slicing hard materials, typically gemstones. Mounted points. Mounted points are small grinding wheels bonded onto a mandrel.

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Our Equipment - Diamond Wire Wafer Cutting and Slicing

Diamond Wire Slicing System. With the most advanced diamond wire saw in the world we can offer the most cost effective slicing for extremely hard materials such as sapphire, silicon carbide and ruby. – 200 mm diameter capability – High wire speeds up to 25 meters per second – Rocking angle up to ± 12 degrees (24 degree total)

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Kadco

Kadco Ceramics is dedicated to the precision diamond machining of hard materials into intricate shapes. Since 1982 Kadco has focused on providing engineering assistance and production solutions to a broad spectrum of industrial and R&D needs.

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Faster Slicing with Fixed-Diamond Wire - Ceramic Industry

Faster Slicing with Fixed-Diamond Wire. February 1, 2005. Reprints ... Finally, this method can only achieve slow material removal rates, especially during the slicing of hard materials such as SiC or sapphire, where loose abrasive tends to wear the relatively soft .

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Semiconductor Wafer Slicing Equipment & Solar Cell Wafer ...

Besides, we are tackling a substrate slicing, and now we can slice hard materials such sapphire and magnetic materials. In addition, we propose a cutting equipment which meets the needs and wants of customers. Line-ups of semiconductor wafer slicing equipment and solar cell wafer slicing equipment.

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Slicing manufacturing cost with high-shear tooling ...

Oct 19, 2016 · Slicing manufacturing cost with high-shear tooling ... process from a "chiseling" action to slicing and shearing. ... pressure provides optimal cut quality in soft and hard materials alike. ...

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US8291895B2 - Methods, wires, and apparatus for slicing ...

Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another type of wire, can be used to slice workpieces useful for producing wafers.

ultrasonic cutting slicing cheese cutter equipment - YouTube

Apr 10, 2019 · From soft like brie to hard Pecorino, our ultrasonic food cutting and slicing machines are designed for all shapes including round, stick, block and extruded cheese. Over the years, we have ...

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2019 Best 3D Slicer Software for 3D Printers (Most are ...

Want to get the best results from your 3D printer? Check out our guide to the best 3D slicer software tools available right now. Most are free. The process that ignites 3D printing innovation is comprised of a few essential tools. Obviously, you have the 3D model and the 3D printer, but there's an ...

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Slicing manufacturing cost with high-shear tooling ...

Oct 19, 2016 · Slicing manufacturing cost with high-shear tooling ... process from a "chiseling" action to slicing and shearing. ... pressure provides optimal cut quality in soft and hard materials alike. ...

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Which Cutting Boards are Best for Knives? - CuttingBoard

May 10, 2015 · Which Cutting Boards are Best for Knives? Posted by Grant Chen on May 10 ... let's talk about how the cutting board material factors in. If you have a board made from a hard material, it will cause your knife edge to roll because there is less give. ... will often be better for your knives because there will be more consistent pressure along ...

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Slicing - meyerburger

Slicing. For slicing hard and brittle materials, the slurry and diamond wire-technologies are employed. They enable sapphire crystals, ceramics, glass, quartz and other hard materials to be sliced.

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Crystal slicing automatic machine - YouTube

Aug 01, 2012 · The device is intended for slicing of single crystal sapphire ingots, notably of sapphire monocrystals, as well as for slicing of other hard or superhard materials. Slicing .

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Experiment study on electroplated diamond wire saw slicing ...

As a kind of hard-brittle material, the key technical challenges for fixed-abrasive wire saw (FAWS) slicing single-crystal silicon are wafer surface integrity and shape accuracy, including the wafer surface topography, surface roughness, subsurface damage depth, wafer warp and total thickness variation, etc.

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Products - Meyer & Burger Slicing Machines

The TS-205 annular saw has been designed for automatic cropping and wafer slicing of long ingots of hard and brittle materials, particularly semiconductors. The special ingot holding system offers cutting of ingots into sections, slicing sample wafers and cropping off the end pieces.

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